发明名称 |
Film forming method |
摘要 |
CVD is performed without damaging a micro-fabricated semiconductor element. An organic material gas containing amine is used as deposition material gas. The material gas is introduced into a vacuum chamber and ultraviolet light radiated from each of lamps is applied onto an object to be processed that is placed in the chamber, thereby causing chemical vapor deposition to be carried out, whereby a film is grown at a temperature such that no damage is given to a semiconductor element or the like of the object.
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申请公布号 |
US7122486(B2) |
申请公布日期 |
2006.10.17 |
申请号 |
US20040844543 |
申请日期 |
2004.05.13 |
申请人 |
OKI ELECTRIC INDUSTRY CO., LTD. |
发明人 |
TOSHIKAWA KIYOHIKO;MIYANO JUNICHI |
分类号 |
H01L21/31;C23C16/02;C23C16/34;C23C16/48;H01L21/312;H01L21/318;H01L21/469;H01L21/768 |
主分类号 |
H01L21/31 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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