发明名称 |
Multilayer wiring board assembly, multilayer wiring board assembly component and method of manufacture thereof |
摘要 |
A multilayer wiring board assembly, a multilayer wiring board assembly component and a method of manufacture thereof are described in which it is possible to easily laminate together flexible FPCs having highly packing densities by via-on-via and chip-on-via. The multilayer wiring board assembly is laminated by laminating together a plurality of multilayer wiring board assembly components, each of which is made by preparing a copper plated resin film 10 made of a copper plated resin film made of a resin film having adhesivity which is provided with a copper foil bonded to one surface thereof and in which a through hole is opened through said copper foil and said resin film, and a conductive paste filler embedded by screen printing in the through hole of said copper plated resin film from said copper foil with a leading end of said conductive paste filler being projected from said resin film.
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申请公布号 |
US7122746(B2) |
申请公布日期 |
2006.10.17 |
申请号 |
US20040832433 |
申请日期 |
2004.04.27 |
申请人 |
FUJIKURA LTD. |
发明人 |
HIGUCHI REIJI;ITOU SHOUJI;NAKAO OSAMU |
分类号 |
H01R12/04;H05K1/00;H05K1/11;H05K3/02;H05K3/24;H05K3/36;H05K3/40;H05K3/46 |
主分类号 |
H01R12/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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