发明名称 |
Method of manufacturing a semiconductor device using a rigid substrate including the vent-end edge portion of the substrate has a thickness smaller than the other portions of the substrate |
摘要 |
In a method of manufacturing a semiconductor device of the invention, a rigid substrate which supports one or more semiconductor elements on a surface of the substrate and is clamped between an upper mold and a lower mold of an encapsulation mold at a time of resin encapsulation is provided, so that a vent-end edge portion of the substrate corresponding to a vent end of the encapsulation mold has a thickness smaller than a thickness of other portions of the substrate. The substrate is disposed in the encapsulation mold, and resin is injected into a cavity between the upper mold and the substrate to encapsulate the semiconductor elements with the resin. |
申请公布号 |
US7122402(B2) |
申请公布日期 |
2006.10.17 |
申请号 |
US20040781794 |
申请日期 |
2004.02.20 |
申请人 |
FUJITSU LIMITED |
发明人 |
NAGAHAMA YOUHEI;WAKO KATSUNORI;ASANO YUICHI;TAKAHASHI MASANORI;KOJIMA HARUO;FUJIMOTO MASAMICHI;OHTSUBO HIROSHI;YASUDA YUKI |
分类号 |
H01L21/44;H01L21/48;H01L21/50;H01L21/56 |
主分类号 |
H01L21/44 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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