| 发明名称 |
Low cost power semiconductor module without substrate |
| 摘要 |
A power module for low voltage applications, which does not include an insulated metal substrate is disclosed. The module includes a power shell and a plurality of lead frames each lead frame including a conductive pad on which one or more MOSFETs may be electrically mounted. The MOSFETs are electrically connected via wire bonds.
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| 申请公布号 |
US7122890(B2) |
申请公布日期 |
2006.10.17 |
| 申请号 |
US20030635359 |
申请日期 |
2003.08.06 |
| 申请人 |
INTERNATIONAL RECTIFIER CORPORATION |
发明人 |
GRANT WILLIAM |
| 分类号 |
H01L23/04;H01L25/07;H01L23/10;H01L23/12;H01L23/34;H01L25/16;H01L25/18;H02M7/00 |
主分类号 |
H01L23/04 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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