| 摘要 |
A substrate processing apparatus is provided to perform various kinds of etch processes by using a plurality of chemicals. A substrate is supported by a substrate support member(100) capable of rotating. A liquid supply member(200) selectively supplies a plurality of liquids to the substrate placed on the substrate support member. An inner space in which the substrate support member is positioned is formed in a liquid collecting member(300) for collecting the liquids supplied from the liquid supply member. An exhaust member(400) is connected to the liquid collecting member in a manner that the air current facing toward the liquid collecting member is uniformly formed in the inner space, disposed under the liquid collecting member. An elevation member transfers at least one of the substrate support member and the liquid collecting member to vary the relative height of the substrate support member with respect to the liquid collecting member, disposed in the liquid collecting member. The inner space is surrounded by a housing(320). The liquid supplied to the substrate is collected in a plurality of liquid collecting cases vertically stacked in the housing. A plurality of guide portions form a plurality of paths to make the air current in the inner space face toward the collecting cases, vertically stacked in the housing. The cross section of each path increases as it goes to the lower part of the housing.
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