| 摘要 |
A polishing apparatus is provided to prevent dust powder of a substrate during a polishing process from being introduced into a space for forming other processes by easily discharging the dust powder to the outside. A polishing part(160) polishes a substrate(150) supplied to a chamber(110), disposed in the chamber. A press part(170) presses the inside of the chamber so that the dust powder of the substrate polished by the polishing part is exhausted to the outside of the chamber. The chamber has a high pressure than the atmospheric pressure.
|
