发明名称 LIQUID COMPOSITION, PROCESS FOR PRODUCING THE SAME, FILM OF LOW DIELECTRIC CONSTANT, ABRADANT AND ELECTRONIC COMPONENT
摘要 A porous-structured diamond micrograin film known as a film of high heat resistance and low dielectric constant also exhibits high thermal conductivity and is promising as a multilayer wiring insulating film of semiconductor integrated circuit devices. However, diamond micrograin liquid compositions as a film raw material have had poor colloid stability and in film production, have exhibited poor reproducibility and yield. Diamond micrograin colloid liquid composition can have strikingly low viscosity and high stability when a small amount of amine is incorporated therein. Various coaters can be utilized by adjusting the viscosity thereof to desirable level with the use of a thickening agent according to necessity. As a result, a film of low dielectric constant exhibiting a specific inductive capacity of about 2.5 has been obtained. Further, the above liquid composition can be used as a finishing abradant.
申请公布号 KR20060107742(A) 申请公布日期 2006.10.16
申请号 KR20067007609 申请日期 2006.04.20
申请人 JAPAN SCIENCE AND TECHNOLOGY AGENCY;RORZE CORPORATION;DAIKEN CHEMICAL CO., LTD. 发明人 TAKAHAGI TAKAYUKI;SAKAUE HIROYUKI;SHINGUBARA SHOSO;TOMIMOTO HIROYUKI;SAKURAI TOSHIO;UCHIYAMA MASAHIKO;ISHIKAWA SACHIKO
分类号 H01L21/304;C09K3/14;H01L21/02;H01L21/314 主分类号 H01L21/304
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