发明名称 METHOD AND DEVICE FOR PROCESSING SEMICONDUCTOR WAFER
摘要 <p>A method of processing a semiconductor wafer including the steps of executing a permutation processing by using a plurality of processing containers while sequentially transferring the wafers into the containers or performing a parallel processing and a transfer mechanism used commonly for the containers while sequentially transferring the wafers. The wafer processing is performed after the completion of conditioning of the vessel, and a conditioning start time for a next container is adjusted so that the completion of conditioning occurs when processing in the previous container is completed.</p>
申请公布号 KR100633890(B1) 申请公布日期 2006.10.13
申请号 KR20047008213 申请日期 2002.11.29
申请人 发明人
分类号 H01L21/02;G05B19/418;H01L21/00 主分类号 H01L21/02
代理机构 代理人
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