| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a flexible printed circuit board which can form a bump on wiring even in the high-density mounting, and also to provide a flexible circuit board which can reliably achieve a high-density mounting. SOLUTION: The flexible printed circuit board comprises an insulating layer 12, and a wiring pattern formed by patterning a conductor layer 11 laminated on at least one surface of the insulating layer 12 and having a semiconductor chip mounted thereon. The method for manufacturing the flexible printed circuit board comprises the steps of a first etching step of etching the conductor layer 11 with use of a first resist pattern 42 to form a first wiring pattern 21 passed through the conductor layer in a thickness direction; and a second etching step of exposing and developing the first resist pattern 42 with use of a second mask 43, to form a second resist pattern 44 left as only part of the first resist pattern, and half etching the conductor layer halfway in the thickness direction to obtain a second wiring pattern 31a as a thin-walled part. COPYRIGHT: (C)2007,JPO&INPIT |
