| 摘要 |
PROBLEM TO BE SOLVED: To improve traceability by directly reading independent information such as positional information on a wafer, at the same time by writing the independent information without an error, and to improve the workability of writing and reading in semiconductor manufacturing equipment. SOLUTION: The semiconductor manufacturing equipment is provided with a die bonder 62 which bonds and fixes each semiconductor chip 2a and the like obtained in a dicing process to a lead frame, a support bar, or a wiring board. There are provided a reader 63 by which the die bonder 62 reads positional information on a wafer such as the semiconductor chip 2a prior to bonding and fixing, and a storage device 64 for storing positional information on the wafer such as the semiconductor chip 2a read by the reader 63 after bonding and fixing on an outer lead of the lead frame, the support bar, or the outer surface of the wiring board at a bonding and fixing position of the semiconductor chip 2a and the like. COPYRIGHT: (C)2007,JPO&INPIT
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