| 摘要 |
PROBLEM TO BE SOLVED: To provide a ceramic circuit board with excellent thermal shock resistance, which has a gap formed between a circuit pattern section and a ceramic substrate and can prevent etchant residues from remaining in the gap, and a manufacturing method thereof. SOLUTION: A ceramic circuit board related to the present invention comprises brazing filler metal patterns 8 and 9 formed on a ceramic substrate 1 and a circuit pattern section joined onto the brazing filler metal patterns. The brazing filler metal patterns extend along the edge of the circuit pattern section, and a gap is formed between the ceramic substrate and the circuit pattern section so that the gap is located within the brazing filler metal patterns. COPYRIGHT: (C)2007,JPO&INPIT
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