| 摘要 |
PROBLEM TO BE SOLVED: To provide surface treatment copper foil without generating a void or a crack in an interface between copper foil and conductive paste including a low melting point metal, and to provide a laminated circuit substrate capable of using the conductive paste including the low melting point metal by using the copper foil and high in connection reliability. SOLUTION: In the surface treatment copper foil, a roughened treatment layer of the composite of at least one kind of metal or two kinds or more of copper containing the low melting point metal, nickel, a copper alloy or a nickel alloy and having a surface roughness of 0.3-10.0μm is formed on one side of the former foil composed of copper foil or copper alloy foil having a surface roughness of one side of 0.1-5μm or less. The laminated circuit substrate is constituted of the surface treatment copper foil and a substrate, whose through-hole formed at a resin substrate is filled with conductive paste containing the low melting point metal, which are laminated. COPYRIGHT: (C)2007,JPO&INPIT
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