| 摘要 |
PROBLEM TO BE SOLVED: To provide a plating method for forming a metallic layer with high reliability in a simple process. SOLUTION: The plating method comprises the steps of: (a) forming an underlayer 10 on a substrate; (b) forming a surface active agent layer 12 on the underlayer 10; (c) patterning the surface active agent layer 12 to expose the underlayer 10; (d) immersing the substrate into a solution; (e) forming a catalyst layer 26 on the underlayer 10 and on a surface active agent layer 14; (f) patterning the catalyst layer 26 by removing the surface active agent layer 14; and (g) depositing the metallic layer 28 on the catalyst layer 26. COPYRIGHT: (C)2007,JPO&INPIT
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