发明名称 Gas distribution uniformity improvement by baffle plate with multi-size holes for large size PECVD systems
摘要 Embodiments of a gas distribution plate for distributing gas in a processing chamber for large area substrates are provided. The embodiments describe a gas distribution plate assembly for a plasma processing chamber having a cover plate comprises a diffuser plate having an upstream side, a downstream side facing a processing region, and a plurality of gas passages formed through the diffuser plate, and a baffle plate, placed between the cover plate of the process chamber and the diffuser plate, having a plurality of holes extending from the upper surface to the lower surface of the baffle plate, wherein the plurality of holes have at least two sizes. The small pinholes of the baffle plate are used to allow sufficient pass-through of gas mixture, while the large holes of the baffle plate are used to improve the process uniformity across the substrate.
申请公布号 US2006228490(A1) 申请公布日期 2006.10.12
申请号 US20050101305 申请日期 2005.04.07
申请人 APPLIED MATERIALS, INC. 发明人 WANG QUNHUA;HOU LI;YADAV SANJAY D.;FURUTA GAKU;OMORI KENJI;CHOI SOO Y.;WHITE JOHN M.
分类号 C23F1/00;B01J19/08;C23C16/00;H01L21/306 主分类号 C23F1/00
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