| 摘要 |
A semiconductor device includes: a semiconductor substrate having a semiconductor element; an electrode pad electrically connected to the semiconductor element; an insulating layer formed on the substrate, the insulating layer having an opening extended to the electrode pad; a wiring portion electrically connected to the electrode pad via the opening, the wiring portion having an edge located on the insulating layer; and a conductive bump formed directly above the electrode pad so as to cover upper and side surfaces of the wiring portion.
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