WAFER LEVEL PACKAGE INCLUDING A DEVICE WAFER INTEGRATED WITH A PASSIVE COMPONENT
摘要
According to an exemplary embodiment, a wafer level package includes a device wafer including at least one device wafer contact pad and a device, and where the at least one device wafer contact pad is electrically connected to the device. The wafer level package includes a first polymer layer situated over the device wafer. The wafer level package includes at least one passive component situated over the first polymer layer and having a first terminal and a second terminal. The first terminal of the at least one passive component is electrically connected to the at least one device wafer contact pad. The wafer level package includes a second polymer layer situated over the at least one passive component. The wafer level package includes at least one polymer layer contact pad situated over the second polymer layer and electrically connected to the second terminal of the at least one passive component.
申请公布号
WO2006107507(A2)
申请公布日期
2006.10.12
申请号
WO2006US08599
申请日期
2006.03.10
申请人
SKYWORKS SOLUTIONS, INC.;GAN, QING;WARREN, ROBERT;LOBIANCO, ANTHONY;LIANG, STEVE
发明人
GAN, QING;WARREN, ROBERT;LOBIANCO, ANTHONY;LIANG, STEVE