| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a structure and a manufacturing method of an LED chip carrier for increasing a luminance effect in a light-emitting diode without restricting the refraction of a light source and a diffusion range. <P>SOLUTION: In the structure and manufacturing method of the LED chip carrier, a tray having at least one substrate surface predetermined height is installed on a metal substrate, and an LED chip is fixed at the tray. The LED chip and the tray are covered with a related cover material, thus increasing the light source emission angle of the LED chip, expanding the contact area of the cover material, and improving adhesive strength between the cover material and the substrate and the luminance effect in the light-emitting diode. <P>COPYRIGHT: (C)2007,JPO&INPIT |
