| 摘要 |
PROBLEM TO BE SOLVED: To apply a large quantity of adhesive to a terminal without making the adhesive adhere other than the terminal projecting from the board. SOLUTION: When applying thermosetting adhesive to a terminal 51 projecting from a lower face 40a of FPC 50, a thermosetting adhesive layer 60 is formed on a resin sheet 56. While a gap is so formed that the lower face 40a of the FPC 50 is not in contact with the thermosetting adhesive layer 60, the top of the terminal 51 is dipped in the thermosetting adhesive layer 60. While the top of the terminal 51 is dipped in the thermosetting adhesive layer 60, the terminal 51 is moved in the direction along an upper face 57 of the resin sheet 56. COPYRIGHT: (C)2007,JPO&INPIT
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