SEMICONDUCTOR MANUFACTURING DEVICE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND METHOD FOR CLEANING THE SEMICONDUCTOR MANUFACTURING DEVICE

摘要

PROBLEM TO BE SOLVED: To effectively remove any reaction product attached to a narrow clearance between a wafer stage and a focus ring in a semiconductor manufacturing device using plasma discharge. SOLUTION: In this semiconductor manufacturing device, a semiconductor wafer is placed on a wafer stage 2 in a plasma chamber 1, and plasma treatment is carried out to the semiconductor wafer while plasma quantity is adjusted under the control of a focus ring 4 in the outer periphery of the wafer stage 2 by using a plasma to be generated in the chamber 1, and the semiconductor wafer after plasma treatment is carried out of the chamber 1. This semiconductor manufacturing includes a step for relatively displacing the wafer stage 2 and the focus ring 4, in order to increase the degree of exposure of the outer peripheral face of the wafer stage 2 or the inner peripheral face of the focus ring 4, while the semiconductor wafer is not present in the plasma chamber 1 and a step for generating plasma in the chamber 1; for making the plasma react with a reaction product 5 residing in the chamber 1; and for gasifying and exhausting it. COPYRIGHT: (C)2007,JPO&INPIT