发明名称 THERMALLY-CONDUCTIVE RESIN COMPOSITION AND USE OF THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a resin composition having high thermal conductivity, comprising a thermally-conductive resin composition containing an aluminum nitride powder, and given by utilizing high thermal conductivity inherent in aluminum nitride, and to provide a member, such as a film and a sheet, having the high thermal conductive, by using the composition. SOLUTION: This resin composition contains the aluminum nitride powder (A) and a non-silicon-based synthetic resin (B), wherein the aluminum nitride powder (A) has a spherical shape, an average particle diameter of 0.001-500μm, and a porosity≤0.3%. Further, a use of the resin composition is provided. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2006273948(A) 申请公布日期 2006.10.12
申请号 JP20050092667 申请日期 2005.03.28
申请人 MITSUI CHEMICALS INC 发明人 KAMATA JUN;YOSHIDA MITSUNOBU;WATANABE HIROSHI
分类号 C08L101/00;B32B27/20;C08K3/28;H05K1/03 主分类号 C08L101/00
代理机构 代理人
主权项
地址
您可能感兴趣的专利