| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor light emitting device which improves a heat dissipation property of LED itself, and can be mounted to a packaging substrate with sufficient heat dissipation, and to provide a semiconductor luminescence unit using it. <P>SOLUTION: The semiconductor light emitting device comprises a first lead having a first portion thin in thickness, and a second lead thick in thickness; a second lead having a first portion thin in thickness, and a second portion thick in thickness; an embedded resin embedding at least one portion of each the second portions of the first and second leads; the semiconductor light emitting device mounted in the second portion of the first lead exposed within a concave portion prepared in a top surface of the embedded resin; a wire connecting the semiconductor light emitting device with the second lead; a sealing resin sealing the semiconductor light emitting device prepared within the concave portion and the wire; and a hole for fixing prepared in the second portion of the first lead. <P>COPYRIGHT: (C)2007,JPO&INPIT |
