| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To materialize a high radiation efficiency when heat generated by electronic parts mounted on a printed wiring board is radiated, while an error of heights of a plurality of electronic parts can be reliably absorbed. <P>SOLUTION: With this arrangement, a heat sink plate 11 and a heat conduction block 20 are formed on a mounting face of electronic parts of a printed board 6a mounting electronic parts 6c. The heat sink plate 11 is coupled to the printed board 6a at a predetermined space. The heat conduction block 20 is coupled to an opposing face to the printed board 6a of the heat sink plate 11 so as to adjust its position to a direction crossing the printed board 6a, and is closely adhered to the electronic parts 6c mounted on the printed board 6a. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
