| 摘要 |
PROBLEM TO BE SOLVED: To provide the mounting method of a semiconductor chip which permits the three-dimensional mounting of the semiconductor chip onto a circuit substrate, a spacer for mounting the semiconductor chip and a semiconductor device. SOLUTION: When the semiconductor chip 10 is mounted on the circuit substrate 30 with a plurality of bump electrodes 12 on the outer periphery of one surface so as to surround the central part of the chip 10, the frame type spacer 20 is mounted on the circuit substrate 30. Central part of the spacer 20 is opened and is provided with a predetermined height and connecting electrodes 22 extended into up-and-down direction under the condition that the upper end faces thereof are exposed at positions opposed to respective bump electrodes 12 of the semiconductor chip 10. Bump electrodes 23 are provided on the lower end surfaces of the connecting electrodes 22. Then the bump electrodes 12 are connected to respective connecting electrodes 22 exposed on the upper surface of the spacer 20 and the semiconductor chip 10 is mounted on the spacer 20. COPYRIGHT: (C)2007,JPO&INPIT |
