发明名称 SOLID-STATE IMAGE PICKUP ELEMENT AND MANUFACTURING METHOD THEREOF
摘要 PROBLEM TO BE SOLVED: To provide a high-sensitivity solid-state image pickup element excellent in optical characteristics by planarizing a charge transfer electrode, and also, excellent in charge transfer characteristics while having a first layer electrode and a second layer electrode uniform in film thickness. SOLUTION: The solid-state image pickup element manufacturing method is used for manufacturing the solid-state image pickup element provided with a photoelectric converter, and a charge transfer having the charge transfer electrode in a single layer structure that transfers charges made to occur in the photoelectric converster. The method includes a first planarization process in which planarization is executed by a chemical mechanical polishing (CMP) method when planarizing after forming a second layer conductive film on the first layer electrode via an insulating film, and a second planarization process for etching the second layer conductive film so as to have almost the same height as that of the first layer electrode 3a by an etch back method. The height of the first layer electrode 3a and that of the second layer electrode 3b are leveled. Consequently, a flat and high-sensitivity solid-state image pickup element can be formed. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2006278690(A) 申请公布日期 2006.10.12
申请号 JP20050095251 申请日期 2005.03.29
申请人 FUJI PHOTO FILM CO LTD 发明人 MAKITA TAKESHI
分类号 H01L27/148 主分类号 H01L27/148
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