发明名称 LASER DEPOSITION PROCESS AND APPARATUS, AND ELECTRONIC EQUIPMENT
摘要 PROBLEM TO BE SOLVED: To provide a laser deposition process and apparatus in which injection energy of a laser beam and the size of required facility are reduced, and to provide electronic equipment. SOLUTION: In the laser deposition process, a film pattern 40 containing a functional liquid material is formed on a substrate 21 and irradiated with a laser beam, and a wiring pattern is formed with heat generated through photothermal transformation caused by absorbing laser light. During the process from initial stage of firing for forming the wring pattern to the latter stage of firing, the film pattern 40 is irradiated with laser beams 50 and 53 of two optimal wavelengths exhibiting good absorption efficiency while setting a time difference depending on the absorption spectrum of the film pattern 40 varying at each step. In the latter stage of firing for forming a wiring pattern by advancing firing of the film pattern 40 with heat generated through photothermal transformation caused by irradiation with laser beam 50, the film pattern 40 is irradiated with a laser beam 53 by using a laser (laser body 54) of low unit output cost. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2006278659(A) 申请公布日期 2006.10.12
申请号 JP20050094780 申请日期 2005.03.29
申请人 SEIKO EPSON CORP 发明人 GOHARA MASAYOSHI;AMAKO ATSUSHI
分类号 H01L21/3205;H01L21/288 主分类号 H01L21/3205
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