| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for evaluating microroughness of semiconductor wafer surface easily in order to perform polishing and cleaning of a semiconductor wafer effectively during production thereof, and to provide a process for producing a semiconductor wafer by using that evaluation method. SOLUTION: In the method for evaluating a semiconductor wafer, haze value of semiconductor wafer surface is measured previously for vertical irradiation/high angle light reception and/or oblique irradiation/low angle light reception, surface profile of the wafer is measured and its data converted into power spectrum, and then correlation of power spectral density of that power spectrum and the haze value for vertical irradiation/high angle light reception at space wavelength of 1μm and/or correlation of power spectral density and the haze value for oblique irradiation/low angle light reception at space wavelength of 0.1μm are determined. A process for producing a semiconductor wafer by evaluating the surface profile of wafer using that method and adjusting the polishing conditions and/or the cleaning conditions depending on the evaluation results is also provided. COPYRIGHT: (C)2007,JPO&INPIT
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