| 摘要 |
PROBLEM TO BE SOLVED: To provide a resist removal device which can quickly remove a resist formed on the surface of a substrate, and to provide a resist removal method. SOLUTION: The resist removal device is provided with a spin chuck 1 which can turn a wafer W while holding it almost horizontally, and a nozzle 2 to supply SPM to the surface of the wafer W held by the spin chuck 1. The nozzle 2 is connected with the tip end of the SPM supply piping 8 extending from a mixing valve 7. A sulfuric acid of which temperature is adjusted at 100°C or more and an oxygenated water of which temperature is not adjusted are supplied to the mixing valve 7. The sulfuric acid and the oxygenated water are mixed by the mixing valve 7 to make an SPM, which is fed to the nozzle 2 from the mixing valve 7 through an SPM supply piping 8. COPYRIGHT: (C)2007,JPO&INPIT
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