| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method of reflow soldering which can assure solder wettability sufficient about the electronic part of 0603 or less sizes, even when reflow soldering is performed in an air atmosphere. <P>SOLUTION: This method of reflow soldering includes a pre-heating step of heating a lead-free solder at preheating temperature of 150°C-170°C, and primary heating step (a peak temperature in the primary heating step is 240°C-255°C) of heating lead-free solder at the temperature higher than the melting temperature of 217°C-220°C. The total heating time of the lead-free solder is 180-190 seconds. For the sake, it follows on the minimum of the electronic part, even if the amount of the solder of the lead-free solder on the land of the substrate decreases, the remarkable oxidation of the lead-free solder can be prevented. Therefore, even when the reflow soldering is performed in the air atmosphere, the solder wettability sufficient about the electronic part of 0603 or less sizes can be assured and it is derived. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
