| 摘要 |
PROBLEM TO BE SOLVED: To provide a reactive hot-melt type silicone adhesive having good gap filling properties for an adherend having great unevenness on the surface even during thermocompression bonding under low pressure and firmly bonding to the adherend by cross-linking. SOLUTION: The hot-melt type silicone adhesive is composed of at least (A) an organopolysiloxane resin, (B) an alkenyl group-containing organopolysiloxane, (C) (i) an organopolysiloxane containing a silicon atom-bound hydrogen atom and (ii) an organosilicon compound containing a silicon atom-bound alkoxy group or (iii) an organopolysiloxane containing a silicon atom-bound hydrogen atom and a silicon atom-bound alkoxy group, (D) a catalyst for a hydrosilylation reaction and (E) a hydrosilylation reaction inhibitor. (A) The organopolysiloxane resin has 40-250°C softening point. (B) The an alkenyl group-containing organopolysiloxane is a liquid or a crude rubber-like state at 25°C. COPYRIGHT: (C)2007,JPO&INPIT |
