| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat treatment apparatus, capable of realily improving the in-plane uniformity of illuminance distribution on a substrate, moreover with high reproducibility. SOLUTION: A semiconductor wafer W to be a processing object is held on a holder 7. A light irradiator 5 is provided with a plurality of flash lamps 69 and a reflector 52. On a light-transmitting plate 61, provided in between the light irradiator 5 and the holder 7, an illuminance adjusting plate 10 having a diameter smaller than the diameter of the semiconductor wafer W held by the holder 7 is mounted, such that its center is positioned right above the center of the semiconductor wafer W in a vertical direction. While the quantity of light reaching the inner side of the semiconductor wafer W is lowered due to reflection at the surface and the bottom surface of the illuminance adjusting plate 10, since the light reaching the peripheral edge of the semiconductor wafer W will not be transmitted through the illuminance adjusting plate 10, its light quantity is not lowered. As a result, the in-plane uniformity of the illuminance distribution is improved on the semiconductor wafer W. COPYRIGHT: (C)2007,JPO&INPIT
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