| 摘要 |
PROBLEM TO BE SOLVED: To provide technology for suppressing dispersion of thickness of a semiconductor module in a double-sided side cooling type. SOLUTION: In a soldering jig 40, the inner face of a surface-side conduction board 12 is reflow-soldered to a surface-side electrode 18 of an assembly member, where the rear-face side electrode of a semiconductor element 11 is connected and fixed to an inner-face of a rear face-side conduction board 14. The soldering jig 40 is provided with a lower jig 42, an upper jig 46, a regulating means, and an abutting mechanism. The lower jig 42 supports one conduction board of the rear-face side or a surface-side in a state, where an outer face turns downward. The upper jig 46 is placed on the outer face of the other conduction board of the rear-face side 14 and the surface-side 12, in a state where a solder material 66 for reflow soldering is arranged between the inner face of the surface-side conduction board 12 and the surface-side electrode 18 of the assembly member. The regulating means regulates a fall limit, when the solder material melts and the upper jig falls. The abutting mechanism makes the outer face of the other conduction board abut against the upper jig. COPYRIGHT: (C)2007,JPO&INPIT
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