发明名称 STACKED ELECTRONIC COMPONENT AND ITS MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a stacked electronic component and its manufacturing method capable of facilitating smooth exhaustion of binder removal gas while eliminating level difference caused by a conductive layer. SOLUTION: A plurality of unit sheets 35 having inner electrode layers 5 and 7 and a level difference absorbing layer 6 are laminated on a green sheet 25 constituted of a binder-containing ceramic paste 23, to manufacture the stacked electronic component such as a stacked ceramic capacitor 1. To do so, the level difference absorbing layer is formed around the entire circumference of the inner electrode layer in single-chip regions 43a-43d on at least one unit sheet, and in addition, at least one binder removal gas slit 45 is provided around the inner electrode layer on the level difference absorbing layer. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2006278565(A) 申请公布日期 2006.10.12
申请号 JP20050093072 申请日期 2005.03.28
申请人 TDK CORP 发明人 OKUYAMA HIROSHI
分类号 H01G4/30;H01G4/12 主分类号 H01G4/30
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