发明名称 CONVEYANCE MECHANISM FOR WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To securely convey a board without damaging a conductor pattern or resist formed on the board and improve production yield at the time of conveying the board to a processing bath, or the like for applying plating treatment or etching treatment to the board. SOLUTION: Roll axes 24 mounted with conveyer rolls 22 at predetermined intervals in the axial direction are arranged so as to make their axial directions in parallel with each other. A conveyance mechanism for the wiring board 10 is provided with a rotating/driving mechanism for rotating/driving the respective roll axes 24 to one direction. In the conveyance mechanism, mounting positions of the conveyer rolls 22 in the axial directions on the roll axes 24 are adjusted within a passing width in which dummy regions provided by communicating to the conveyance direction pass through when the wiring board is conveyed by the conveyance mechanism. A feeding mechanism of the wiring board 10 is provided with a guide mechanism 26 for preventing displacement to a direction orthogonal to the conveyance direction of the wiring board. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2006273461(A) 申请公布日期 2006.10.12
申请号 JP20050091945 申请日期 2005.03.28
申请人 FUJITSU LTD 发明人 TAKANO KENJI
分类号 B65G13/04;B65G21/20;B65G39/04 主分类号 B65G13/04
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