ORGANIC ELECTRONIC DEVICES HAVING EXTERNAL BARRIER LAYER

摘要

An organic device package (20) includes a flexible substrate (24) having a topside and a bottom side. Further, the organic device package (20) includes an organic electronic device (28) having a first side and a second side disposed on the topside of the flexible substrate (24). In addition, the organic device package (20) includes a first barrier layer (32) disposed on the bottom side of the flexible substrate (24).