发明名称 RESIN COMPOSITE FOR MOUNTING ELECTRONIC COMPONENT AND MOUNTING METHOD OF ELECTRONIC COMPONENT
摘要 PROBLEM TO BE SOLVED: To provide a resin composite which can display sufficient performance in terms of mounting and sealing without disturbing a function of a solid-state image pickup element and to provide a mounting method of the solid-state image pickup element by using the composite. SOLUTION: The resin composite comprises epoxy resin and a latent curing catalyst. When a minimum valueη<SB>0</SB>of viscosity is 1.0×10<SP>2</SP>Pa s to 1.0×10<SP>4</SP>Pa s, a temperature at which viscosity becomes the minimum valueη<SB>0</SB>is within a range of 50 to 80°C, and maximum viscosity and minimum viscosity in a temperature range of width of 10°C in the range of 50 to 80°C are set to beη<SB>a</SB>andη<SB>b</SB>, in a viscosity-temperature curve obtained by measurement by a rheometer where temperature rising speed is set as 5°C/min, a value of (log<SB>10</SB>η<SB>a</SB>-log<SB>10</SB>η<SB>b</SB>)/10 is 0 to 0.05. When the temperature at which viscosity becomes 1.0×10<SP>5</SP>Pa s is within the range of 100 to 130°C and viscosity at 30°C is set to beη<SB>30</SB>, the value ofη<SB>30</SB>/η<SB>0</SB>is 1 to 10. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2006278589(A) 申请公布日期 2006.10.12
申请号 JP20050093389 申请日期 2005.03.29
申请人 NIPPON STEEL CHEM CO LTD 发明人 ICHIDA TAKESHI;FURUKI SATORU
分类号 H01L23/10;C08G59/68;H01L27/14 主分类号 H01L23/10
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