| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin composition which is superior in electric characteristics, has low coefficient of linear expansion, has high solder thermal resistance, and is superior in adhesiveness to a metal, when it acts as a resin layer. SOLUTION: The resin composition used for an insulating layer of a wiring board comprises a cyclic olefin resin (A) having a structure represented by a formula (1), a formula (2) and a formula (3), wherein the cyclic olefin resin has number average molecular weight of 1,000-1,000,000. In the formula (1), X is one of O, CH<SB>2</SB>and (CH<SB>2</SB>)<SB>2</SB>, and x is an integer of 0-5. R<SB>1</SB>is an alkoxyl group which may be one of R<SB>2</SB>-R<SB>4</SB>hydrogen, straight chain or branched alkyl group, alkenyl group, alkynyl group, allyl group, aryl group, aralkyl group, functional group comprising ester group, functional group comprising (meth)acryl group and functional group comprising ether group. These groups may be bonded through the alkyl group, ether group and ester group. COPYRIGHT: (C)2007,JPO&INPIT
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