| 摘要 |
PROBLEM TO BE SOLVED: To provide a method and apparatus for evaluating micro roughness (surface roughness) of semiconductor wafer surface accurately. SOLUTION: Surface profile of a semiconductor wafer is measured at least under two different measurement conditions, and data of each measured surface profile is converted into power spectrum. Such a peak as having a mismatching spatial frequency among peaks appearing in each power spectrum is discriminated as noise component, and the semiconductor wafer is evaluated by removing the noise component thus discriminated from at least one power spectrum. The apparatus for evaluating a semiconductor wafer comprises a surface profile measuring means, a power spectrum converting means, and a noise component discriminating/removing means. COPYRIGHT: (C)2007,JPO&INPIT
|
