| 摘要 |
PROBLEM TO BE SOLVED: To provide a plating method and the manufacturing method of an electronic device capable of easily obtaining the desired thickness of a metal layer. SOLUTION: The plating method for a substrate 10 showing a first polarity and having at least first and second pattern regions 12, 14, includes the step of forming a metal layer on the first and the second pattern regions 12, 14 of the substrate 10. Further, the method includes a step (a) of forming a first surface-active agent layer 20 of a second polarity on the first pattern region 12; a step (b) of forming a second surface-active agent layer 22 that is the same polarity as in the first surface-active agent layer 20 at least on second pattern region 14, and has an absolute value smaller than that of the first polarity shown by the first surface-active agent layer 20; a step (c) of forming a catalyst layer 40 on the first and the second surface-active agent layers 20, 22, and a step (d) of depositing the metal layer on the catalyst layer 40. COPYRIGHT: (C)2007,JPO&INPIT
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