发明名称 MANUFACTURING METHOD OF LAMINATED CERAMIC ELECTRONIC COMPONENT
摘要 PROBLEM TO BE SOLVED: To provide a manufacturing method of a laminated ceramic electronic component with superior stack performance for suppressing deviation in lamination and, moreover, causing less delamination. SOLUTION: A preliminary laminator Un is obtained by laminating a prescribed number of green sheets 10a. Then the preliminary laminator Un is dried, and a final laminator Uf is obtained by laminating the preliminary laminators Un, after drying. Furthermore, the final laminator Uf is cut off to form baked green chips. The reduction rate of the weight of the preliminary laminator Un, after drying with respect to the weight of the preliminary laminator Un before drying, is 0.2 to 1.0%, and, more preferably, is 0.2 to 0.6%. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2006278764(A) 申请公布日期 2006.10.12
申请号 JP20050096152 申请日期 2005.03.29
申请人 TDK CORP 发明人 FUKUOKA TOMOHISA;KARATSU SHINKO;SATO SHIGEKI
分类号 H01G4/12;H01G4/30;H01G13/00 主分类号 H01G4/12
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