发明名称 |
Method of writing identifying information on wafer |
摘要 |
A method of writing identifying information comprises: the step of forming a metal film on a wafer; the step of forming a resist layer on the metal film; the step of exposing the resist layer by projecting a pattern for an alignment mark on the resist layer; the first development step of developing the resist layer; the step of exposing the resist layer by projecting a pattern for the identifying information onto the resist layer using the pattern formed in the resist layer in the first development step as a reference of a location; the second development step of developing the resist layer; the step of selectively etching the metal film using the resist layer as an etching mask; and removing the resist layer.
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申请公布号 |
US2006228651(A1) |
申请公布日期 |
2006.10.12 |
申请号 |
US20060350733 |
申请日期 |
2006.02.10 |
申请人 |
SAE TECHNOLOGIES (H.K.) LIMITED |
发明人 |
TAJIMA SHIGEKAZU;TSUKIYAMA SATOSHI;IIJIMA AKIO |
分类号 |
G03F7/20 |
主分类号 |
G03F7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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