发明名称 |
Method for fabricating image sensor using wafer back grinding |
摘要 |
Provided is a method for fabricating an image sensor using a wafer back grinding process. The method includes: forming a microlens protection layer over a substrate structure including a light sensing device and other associated devices; opening a pad open unit of the substrate structure using a mask; removing the mask; forming a photoresist layer over the substrate structure with the microlens protection layer; gluing a tape on the photoresist layer; performing a wafer back grinding process; and removing the tape and the photoresist layer.
|
申请公布号 |
US2006228826(A1) |
申请公布日期 |
2006.10.12 |
申请号 |
US20060399941 |
申请日期 |
2006.04.06 |
申请人 |
MAGNACHIP SEMICONDUCTOR, LTD. |
发明人 |
KIM EUN-JI;KWON KYOUNG-KUK |
分类号 |
H01L21/00;H01L21/339 |
主分类号 |
H01L21/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|