| 摘要 |
The invention relates to an operating housing comprising four lateral walls, a front wall, and a rear wall (2), and a cooling device for carrying off dissipated heat from integrated electronic components. The aim of the invention is to provide one such operating housing which has a compact structure and efficiently cools electronic components. To this end, the cooling device has a cooling plate (10) through which a cooling liquid flows and which forms the largest part of the rear wall (2). |
