| 摘要 |
The present invention relates to a camera module, and more particularly, to a camera module which is miniaturized by changing the structure of a housing joined to a PCB on which a standardized image sensor is wire-bonded and a method of manufacturing the camera module. The camera module includes a PCB to which an image sensor is connected by a wire bonding section; and a housing that holds a lens section. The housing includes a joining section that is joined to the side where the wire bonding section of the PCB is not formed; and a step section that is formed to recede in a portion corresponding to the wire bonding section of the PCB.
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