| 摘要 |
PROBLEM TO BE SOLVED: To provide the polyimide film which is excellent in heat dissipation and capable of effectively using the same as a base film or a cover lay of a flexible circuit board. SOLUTION: The polyimide film has a thermal conductivity along the thickness direction of the film of 0.1 W/mK or greater, preferably a thermal conductivity along at least one direction in the plane of the film of 0.6 W/mK or greater, and further preferably a ratio of the thermal conductivity along the thickness direction of the film to a mean thermal conductivity along directions in the plane of the film of 0.1-0.9. The flexible circuit board is made of the polyimide film. COPYRIGHT: (C)2007,JPO&INPIT |
