APPARATUS AND METHOD FOR SPUTTERING

摘要

PROBLEM TO BE SOLVED: To provide an apparatus for sputtering provided with a plurality of sputtering targets.

SOLUTION: The apparatus for sputtering forming a thin film on a substrate 13 to be film-formed through sputtering a target comprises: a vacuum vessel 10; first to third sputtering targets 24 to 26 placed in the vacuum vessel 10; high-frequency power sources 33 to 35 for outputting a high-frequency current respectively to the first to third sputtering targets 24 to 26; and a susceptor 14 which is placed in the vacuum vessel and holds the substrate to be film-formed.

COPYRIGHT: (C)2007,JPO&INPIT