| 摘要 |
PROBLEM TO BE SOLVED: To obtain high-frequency communication equipment capable of feeding a high-frequency signal to a dipole antenna without packaging a grounding means, such as a via hole, onto a semiconductor substrate. SOLUTION: A differential amplifier 3 is formed on the same semiconductor substrate 1 as antenna element patterns 2a, 2b of a dipole antenna. The differential amplifier 3 amplifies a differential signal when the differential signal that is a transmission signal is inputted, and feeds the amplified differential signal to the antenna element patterns 2a, 2b of the dipole antenna. Or, a differential amplifier 10 is formed on the same semiconductor substrate 1 as the antenna element patterns 2a, 2b of the dipole antenna. The differential amplifier 10 amplifies a differential signal for outputting to I/O terminals 5a, 5b when the differential signal that is a reception signal is inputted from the antenna element patterns 2a, 2b of the dipole antenna. COPYRIGHT: (C)2007,JPO&INPIT
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