发明名称 CONDUCTIVE WIRING MATERIAL, MANUFACTURING METHOD OF WIRING SUBSTRATE AND WIRING SUBSTRATE THEREOF
摘要 PROBLEM TO BE SOLVED: To provide a conductive wiring material, a manufacturing method of a wiring substrate and a wiring substrate thereof. SOLUTION: The manufacturing method of the wiring substrate includes a step of printing a wiring material including a plurality of first metal nano particles and second metal nano particles of particle sizes smaller than those of a plurality of the first metal nano particles and can fill spaces of the first metal nano particles with the molten second metal nano particles by low temperature-sintering on a base film, and a step of sintering at a low temperature the base film on which the wiring material is printed, and the second metal nano particles are molten by the low temperature-sintering and the spacing of the first metal nano particles are filled therewith. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2006279038(A) 申请公布日期 2006.10.12
申请号 JP20060077563 申请日期 2006.03.20
申请人 SAMSUNG ELECTRO-MECHANICS CO LTD 发明人 SON YON-A;KIM TAE-HAAN
分类号 H05K1/09;B22F1/00;B22F3/22;H01B1/22;H01B5/00;H01L23/14;H05K3/10;H05K3/12 主分类号 H05K1/09
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