| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor device which enhances connection reliability by increasing adhesion between a metal film containing nickel and another metal film formed on the surface of the metal film, and an apparatus for plating a semiconductor substrate. SOLUTION: A method of manufacturing the semiconductor device comprises a step of forming a metal film containing nickel on a semiconductor substrate by using an electroplating method, and a step of washing away the metal film with a hydrochloric acid solution or a sulfuric acid solution. COPYRIGHT: (C)2007,JPO&INPIT
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