| 摘要 |
PROBLEM TO BE SOLVED: To reliably break an oxide film of a pad surface on the entire surface of a wafer with a contact of a low load to obtain a stable contact in the wafer in a lump. SOLUTION: This inspecting device has an inspecting board 4 opposing to a surface of a semiconductor wafer 1; a wiring board 5 containing a wiring layer 5a; a cylindrical bump 7 and a dummy bump 8 provided in a region corresponding to an external pad 2A of the semiconductor wafer 1 in an elastic sheet 6 and having a smooth distal end; and an anisotropic conductive rubber sheet 10 provided between the wiring board 5 and the elastic sheet 6, for electrically connecting one end of the wiring layer 5a to an isolation pattern 9. The other end of the wiring layer 5a is connected to a power supply and the inspecting device for supplying an inspecting voltage. The pads on the semiconductor wafer 1 with which the bump 7 and the dummy bump 8 come into contact, respectively, are connected to each other through the wiring 3, and a voltage is applied to between the bump 7 and the dummy bump 8 by an external power source to make a breakdown of the oxide film on a surface of the external pad 2A. COPYRIGHT: (C)2007,JPO&INPIT
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