发明名称 RESIN SEAL TYPE ELECTRIC CIRCUIT DEVICE AND DEVICE FOR INJECTING RESIN
摘要 PROBLEM TO BE SOLVED: To provide a resin seal type electric circuit device capable of uniformly injecting a sealing resin easily into a case and a resin sealing device. SOLUTION: A nozzle assay 108 has a nozzle 112 abutted in its annular section 112a against the periphery of an injection hole 42 on the surface 18a of a first substrate 18, a nozzle supporter slidably holding the nozzle 112 in the vertical direction and a robot lifting and lowering the nozzle supporter. An O ring surrounding the injection hole 42 is fitted to a section abutted against the first substrate 18 in a nose annular section 112a. The nose annular section 112a is pushed against the first substrate 18, and a feed passage is kept in a liquid-tight manner by the O ring. The sealing resin 22 is supplied from a resin supply means, and supplied between a bottom section 12 and the first substrate 18 from the injection hole 42. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2006278900(A) 申请公布日期 2006.10.12
申请号 JP20050098555 申请日期 2005.03.30
申请人 HONDA MOTOR CO LTD 发明人 NOJIMA AKIHISA;KONDO YASUO;UEDA TAKESHI
分类号 H01L23/28;H01L21/56;H01L23/12 主分类号 H01L23/28
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